Showing 141 - 160 results of 165 for search 'Gan, Chee-Lip', query time: 0.04s Refine Results
  1. 141
    Compositional dependence of Sn-Bi solder on the intermetallic compound (IMC) growth kinetics with Cu at thin film scales

    Compositional dependence of Sn-Bi solder on the intermetallic compound (IMC) growth kinetics with Cu at thin film scales by Zhou, Yingxiu.

    Published 2013
    Other Authors: “…Gan Chee Lip…”
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    Final Year Project (FYP)
  2. 142
    Compositional dependence of Sn-Zn solder on the intermetallic compound (IMC) growth kinetics with Cu at thin film scales

    Compositional dependence of Sn-Zn solder on the intermetallic compound (IMC) growth kinetics with Cu at thin film scales by Hidajat, Vincent Sebastian.

    Published 2013
    Other Authors: “…Gan Chee Lip…”
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    Final Year Project (FYP)
  3. 143
    Graphene growth through segregation method

    Graphene growth through segregation method by Kristianto, Ronald.

    Published 2013
    Other Authors: “…Gan Chee Lip…”
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    Final Year Project (FYP)
  4. 144
    Characterization of Cu-Sn-In thin films for three-dimensional heterogeneous system integration

    Characterization of Cu-Sn-In thin films for three-dimensional heterogeneous system integration by Sasangka, Wardhana Aji

    Published 2014
    Other Authors: “…Gan Chee Lip…”
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    Thesis
  5. 145
    Electrical properties of AU-GE solder under high temperature

    Electrical properties of AU-GE solder under high temperature by Lau, Fu Long

    Published 2014
    Other Authors: “…Gan Chee Lip…”
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    Thesis
  6. 146
    Investigation of interconnect layout on CU/Low-K TDDB reliability

    Investigation of interconnect layout on CU/Low-K TDDB reliability by Ong, Ran Xing

    Published 2015
    Other Authors: “…Gan Chee Lip…”
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    Thesis
  7. 147
    Synthesis of zirconia microcrystals by hydrothermal method

    Synthesis of zirconia microcrystals by hydrothermal method by Chen, Kenbin

    Published 2015
    Other Authors: “…Gan Chee Lip…”
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    Final Year Project (FYP)
  8. 148
    Electromigration reliability study on copper interconnects under pulsed current conditions

    Electromigration reliability study on copper interconnects under pulsed current conditions by Lim, Meng Keong

    Published 2015
    Other Authors: “…Gan Chee Lip…”
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    Thesis
  9. 149
    Electromigration study of copper interconnects with side reservoir design

    Electromigration study of copper interconnects with side reservoir design by Mario, Hendro

    Published 2016
    Other Authors: “…Gan Chee Lip…”
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    Thesis
  10. 150
    Synthesis of high strength zirconia fibers by electrospinning method

    Synthesis of high strength zirconia fibers by electrospinning method by Toh, Rui Hang

    Published 2016
    Other Authors: “…Gan Chee Lip…”
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    Final Year Project (FYP)
  11. 151
    Exfoliation of BN nanosheets for toughening SiO2f/SiO2 composites

    Exfoliation of BN nanosheets for toughening SiO2f/SiO2 composites by Neo, Pitrie Wen Wei

    Published 2016
    Other Authors: “…Gan Chee Lip…”
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    Final Year Project (FYP)
  12. 152
    Development of automatic polishing for failure analysis of large microchips

    Development of automatic polishing for failure analysis of large microchips by Lee, Gerald Wei Hui

    Published 2016
    Other Authors: “…Gan Chee Lip…”
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    Final Year Project (FYP)
  13. 153
    Copper nanowires bonding for three dimensional interconnections

    Copper nanowires bonding for three dimensional interconnections by Chun, Shu Rong

    Published 2016
    Other Authors: “…Gan Chee Lip…”
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    Thesis
  14. 154
    Development and characterization of shape memory ceramics at micro/nanoscale

    Development and characterization of shape memory ceramics at micro/nanoscale by Zeng, Xiaomei

    Published 2017
    Other Authors: “…Gan Chee Lip…”
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    Thesis
  15. 155
    Synthesis and characterization of ZrO2 shape memory ceramic fibers

    Synthesis and characterization of ZrO2 shape memory ceramic fibers by Zhou, Xinran

    Published 2017
    Other Authors: “…Gan Chee Lip…”
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    Final Year Project (FYP)
  16. 156
    A mechanical study on particulate reinforced polyamides for electronic encapsulations

    A mechanical study on particulate reinforced polyamides for electronic encapsulations by Affreen, Shahnas

    Published 2017
    Other Authors: “…Gan Chee Lip…”
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    Final Year Project (FYP)
  17. 157
    Development of copper nanoparticles for low temperature die-attach applications

    Development of copper nanoparticles for low temperature die-attach applications by Ng, Mei Zhen

    Published 2017
    Other Authors: “…Gan Chee Lip…”
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    Thesis
  18. 158
    Development of polymeric microelectronics packaging encapsulation for harsh environment applications

    Development of polymeric microelectronics packaging encapsulation for harsh environment applications by Phua, Eric Jian Rong

    Published 2018
    Other Authors: “…Gan Chee Lip…”
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    Thesis-Doctor of Philosophy
  19. 159
    Investigation on the elastic properties and crystallization dynamics of phase-change memory material

    Investigation on the elastic properties and crystallization dynamics of phase-change memory material by Lu, Fei

    Published 2018
    Other Authors: “…Gan Chee Lip…”
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    Thesis
  20. 160
    Formulation and characterization of micro/nano Cu paste for electronics bonding

    Formulation and characterization of micro/nano Cu paste for electronics bonding by Ang, Kok Yong

    Published 2018
    Other Authors: “…Gan Chee Lip…”
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    Final Year Project (FYP)

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