Showing 1 - 3 results of 3 for search '288113 Siti Rabiatull Aisha Idris', query time: 0.02s Refine Results
  1. 1
    Effect of multiple reflow and solder bump size solder on intermetallic compound formation between Sn-4Ag-0.5Cu and enig surface finish [electronic resource] /

    Effect of multiple reflow and solder bump size solder on intermetallic compound formation between Sn-4Ag-0.5Cu and enig surface finish [electronic resource] / by 288113 Siti Rabiatull Aisha Idris

    Published 2006
  2. 2
    Interfacial reactions during soldering of lead-free solders on copper and nickel substrates [electronic resource] /

    Interfacial reactions during soldering of lead-free solders on copper and nickel substrates [electronic resource] / by 288113 Siti Rabiatull Aisha Idris

    Published 2012
  3. 3
    Effect of multiple reflow and solder bump size solder on intermetallic compound formation between Sn-4Ag-0.5Cu and enig surface finish /

    Effect of multiple reflow and solder bump size solder on intermetallic compound formation between Sn-4Ag-0.5Cu and enig surface finish / by 288113 Siti Rabiatull Aisha Idris, Ali Ourdjini, Fakulti Kejuruteraan Mekanikal

    Published 2006

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