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303750 Lau, John H.
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Author
303750 Lau, John H.
Showing
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for search '
303750 Lau, John H.
'
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1
A note on the calculation of thermal stresses in electronic packaging by finite element methods /
by
303750 Lau, John H
.
2
Reliability of RoHS-Compliant 2D and 3D IC interconnects /
by
303750 Lau, John H
.
Published c201
3
Low cost flip chip technologies : for DCA, WLSEP and PBGA assemblies /
by
303750 Lau, John H
.
Published 2000
4
Low cost flip chip technologies : for DCA, WLCSP, and PBGA assemblies /
by
303750 Lau, John H
.
Published 2000
5
Chip scale package (CSP): design, materials, processes, reliability, and applications /
by
303750 Lau, John H
.
,
Lee, Shi-Wei Ricky
Published 1998
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