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  1. 1
    Development of rotary table grinding machine for large diameter Si wafers (1st report: Performance investigation of water hydrostatic rotary table)

    Development of rotary table grinding machine for large diameter Si wafers (1st report: Performance investigation of water hydrostatic rotary table) by Jumpei KUSUYAMA, Ayumu HONDA, Takayuki KITAJIMA, Go OKAHATA, Akinori YUI, Toshihiro ITO, A. H. SLOCUM

    Published 2016-09-01
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    Article
  2. 2
    Development of rotary table grinding machine for large diameter Si wafers (2nd report: Performance investigation of wheel spindle designed to govern infeed motion)

    Development of rotary table grinding machine for large diameter Si wafers (2nd report: Performance investigation of wheel spindle designed to govern infeed motion) by Jumpei KUSUYAMA, Ayumu HONDA, Shintaro IWAHASHI, Takayuki KITAJIMA, Akinori YUI, Toshihiro ITO, Xiaodong LU, Alexander H. SLOCUM

    Published 2017-08-01
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    Article

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