A study of material condensation on liquid substrates by Anantha P

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Report to the President for year ended June 30, 2023, Dean, MIT School of Engineering by Chandrakasan, Anantha P.

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Understanding the Energy vs. Adversarial Robustness Trade-Off in Deep Neural Networks by Kyungmi Lee, Anantha P. Chandrakasan

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Conv-RAM: An Energy-efficient SRAM with Embedded Convolution Computation for Low-power CNN based Machine Learning Applications by Biswas, Avishek, Chandrakasan, Anantha P

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CONV-SRAM: An Energy-Efficient SRAM With In-Memory Dot-Product Computation for Low-Power Convolutional Neural Networks by Biswas, Avishek, Chandrakasan, Anantha P

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Flexible Low Power CNN Accelerator for Edge Computing with Weight Tuning by Wang, Miaorong, Chandrakasan, Anantha P

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Efficient Post-Quantum TLS Handshakes using Identity-Based Key Exchange from Lattices by Banerjee, Utsav, Chandrakasan, Anantha P

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A Low-Power Elliptic Curve Pairing Crypto-Processor for Secure Embedded Blockchain and Functional Encryption by Banerjee, Utsav, Chandrakasan, Anantha P

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A Low-Power BLS12-381 Pairing Cryptoprocessor for Internet-of-Things Security Applications by Banerjee, Utsav, Chandrakasan, Anantha P.

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A Low-Power BLS12-381 Pairing Cryptoprocessor for Internet-of-Things Security Applications by Banerjee, Utsav, Chandrakasan, Anantha P

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Understanding the Energy vs. Adversarial Robustness Trade-Off in Deep Neural Networks by Lee, Kyungmi, Chandrakasan, Anantha P

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A high throughput cabac algorithm using syntax element partitioning by Sze, Vivienne, Chandrakasan, Anantha P.

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An Energy-Efficient Biomedical Signal Processing Platform by Kwong, Joyce, Chandrakasan, Anantha P.

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Joint Algorithm-Architecture Optimization of CABAC by Sze, Vivienne, Chandrakasan, Anantha P.

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A Resolution-Reconfigurable 5-to-10-Bit 0.4-to-1 V Power Scalable SAR ADC for Sensor Applications by Yip, Marcus, Chandrakasan, Anantha P.

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An embedded energy monitoring circuit for a 128kbit SRAM with body-biased sense-amplifiers by Sinangil, Yildiz, Chandrakasan, Anantha P.

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Homogeneous chip to wafer bonding of InP-Al2O3-Si using UV/O3 activation by Tan, Chuan Seng, Anantha, P.

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UV/O3 assisted InP/Al2O3–Al2O3/Si low temperature die to wafer bonding by Anantha, P., Tan, Chuan Seng

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6.111 Introductory Digital Systems Laboratory, Spring 2004 by Chandrakasan, Anantha P., Troxel, Donald E.

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A 6-bit, 0.2 V to 0.9 V Highly Digital Flash ADC With Comparator Redundancy by Daly, Denis C., Chandrakasan, Anantha P.

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