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Research Progress of Palladium-Plated Copper Bonding Wire in Microelectronic Packaging by Yuemin Zhang, Haiyun Guo, Jun Cao, Xuefeng Wu, Hewei Jia, Andong Chang
Published 2023-07-01
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Effects of Process Parameters on Bond Properties of Ag-2.35Au-0.7Pd-0.2Pt-0.1Cu Alloy Wire by Hongliang Zhou, Andong Chang, Junling Fan, Jun Cao, Yingchong Zhang, Bin An, Jie Xia
Published 2023-08-01
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3
A Review of Silver Wire Bonding Techniques by Bin An, Hongliang Zhou, Jun Cao, Pingmei Ming, John Persic, Jingguang Yao, Andong Chang
Published 2023-11-01
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4
Research Progress on Bonding Wire for Microelectronic Packaging by Hongliang Zhou, Yingchong Zhang, Jun Cao, Chenghao Su, Chong Li, Andong Chang, Bin An
Published 2023-02-01
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5
Copper Wire Bonding: A Review by Hongliang Zhou, Andong Chang, Junling Fan, Jun Cao, Bin An, Jie Xia, Jingguang Yao, Xiaobin Cui, Yingchong Zhang
Published 2023-08-01
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