Application of high temperature electronics packaging technology to signal conditioning and processing circuits by Riches, S, Cannon, K, Johnston, C, Sousa, M, Grant, P, Gulliver, J, Langley, M, Pittson, R, Serban, S, Baghurst, D, Firmstone, M

Development of high temperature electronics packaging technology for long term operation at 250°C by Riches, S, Cannon, K, Jones, S, Johnston, C, Sousa, M, Grant, P, Shepherd, D, Gulliver, J, Langley, M, Pittson, R, Serban, S, Baghurst, D