Interface reaction between an electroless Ni–Co–P metallization and Sn–3.5Ag lead-free solder with improved joint reliability por Yang, Ying, Huang, Yizhong, Liu, Hai, Chen, Zhong, Balaraju, J. N.

Obter o texto integral
Obter o texto integral

Interface reaction between electroless Ni–Sn–P metallization and lead-free Sn–3.5Ag solder with suppressed Ni3P formation por Yang, Ying, Balaraju, J. N., Huang, Yizhong, Tay, Yee Yan, Shen, Yiqiang, Tsakadze, Zviad, Chen, Zhong

Obter o texto integral
Obter o texto integral