Effect of Ceramic Capillary Parameters on Bonded Morphology and Strength by Jun Cao, Junchao Zhang, Kexing Song, Baoan Wu, Yong Ding, Dingbiao Chen, Yutian Ding

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Research Status of Manufacturing Technology of Tungsten Alloy Wire by Jun Cao, Yongzhen Sun, Baoan Wu, Huiyi Tang, Yong Ding, Kexing Song, Chengqiang Cui

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Study on Manufacturing Technology of Ultra-Thin/Narrow Bonding Cu Strip for Electronic Packaging by Jun Cao, Junchao Zhang, Baoan Wu, Huiyi Tang, Yong Ding, Kexing Song, Guannan Yang, Chengqiang Cui

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Study on Manufacturing Technology of Ag-8.5Au-3.5Pd Fine Alloy Wire by Jun Cao, Junchao Zhang, Baoan Wu, Huiyi Tang, Changchun Lv, Kexing Song, Guannan Yang, Chengqiang Cui, Yangguang Gao

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Study on the effect of heat treatment on the microstructure and properties of C17300 beryllium copper alloy microwires by Jun Cao, Chong Li, Yongzhen Sun, Baoan Wu, Huiyi Tang, Xiaoyu Shen, Kexing Song, Yanjun Zhou, Chengqiang Cui

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Investigation of the Influence of Alloy Atomic Doping on the Properties of Cu-Sn Alloys Based on First Principles by Zongfan Wei, Jiaying Chen, Jingteng Xue, Nan Qu, Yong Liu, Ling Sun, Yuchen Xiao, Baoan Wu, Jingchuan Zhu, Huiyi Tang

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Texture evolution and its influence mechanism on properties of single crystal copper and polycrystalline copper during cumulative deformation by Xin Li, Yanjun Zhou, Yahui Liu, Shaolin Li, Kexing Song, Cunli Feng, Baoan Wu, Pengfei Zhang, Hanjiang Wu, Jihua Gu, Siyu He, Yan Gao

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