Methods to Improve Accuracy of Electronic Component Positioning in Thermoformed Electronics by Behnam Madadnia, Jan Vanfleteren, Frederick Bossuyt

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Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using Simulation by Martin Hubmann, Mona Bakr, Jonas Groten, Martin Pletz, Jan Vanfleteren, Frederick Bossuyt, Behnam Madadnia, Barbara Stadlober

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Process Optimization of Injection Overmolding Structural Electronics with Regard to Film Distortion by Martin Hubmann, Behnam Madadnia, Jonas Groten, Martin Pletz, Jan Vanfleteren, Barbara Stadlober, Frederick Bossuyt, Jatinder Kaur, Thomas Lucyshyn

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