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  1. 1
    Mitigation of Thermal Stability Concerns in FinFET Devices

    Mitigation of Thermal Stability Concerns in FinFET Devices by Bender, Emmanuel, Bernstein, Joseph B., Boning, Duane S.

    Published 2022
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    Article
  2. 2
    Modern Trends in Microelectronics Packaging Reliability Testing

    Modern Trends in Microelectronics Packaging Reliability Testing by Bender, Emmanuel, Bernstein, Joseph B., Boning, Duane S.

    Published 2024
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    Article

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