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    Capillary forces as a limiting factor for sawing of ultrathin silicon wafers by diamond multi-wire saw

    Capillary forces as a limiting factor for sawing of ultrathin silicon wafers by diamond multi-wire saw by Birgit Ryningen, Pål Tetlie, Sverre Gullikstad Johnsen, Halvor Dalaker

    Published 2020-10-01
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