Carbon nanotube bumps for the flip chip packaging system od Yap, Chin Chong, Brun, Christophe, Tan, Dunlin, Li, Hong, Teo, Edwin Hang Tong, Baillargeat, Dominique, Tay, Beng Kang

Polni tekst
Polni tekst

The influence of titanium nitride barrier layer on the properties of CNT bundles od Yap, Chin Chong, Tan, Dunlin, Brun, Christophe, Li, Hong, Teo, Edwin Hang Tong, Dominique, Baillargeat, Tay, Beng Kang

Polni tekst
Polni tekst

Carbon nanostructures dedicated to millimeter-wave to THz interconnects od Brun, Christophe, Tan, Chong Wei, Franck, Pierre, Chong, Yap Chin, Lu, Congxiang, Leong, Chow Wai, Tan, Dunlin, Tay, Beng Kang, Coquet, Philippe, Baillargeat, Dominique

Polni tekst

Carbon based multi-functional materials towards 3D system integration : application to thermal and interconnect management od Chow, W. L., Samani, M. K., Yap, Chin Chong, Tan, Dunlin, Shakerzadeh, Maziar, Brun, Christophe, Teo, Edwin Hang Tong, Baillargeat, Dominique, Tay, Beng Kang

Polni tekst
Polni tekst