Carbon nanotube bumps for the flip chip packaging system by Yap, Chin Chong, Brun, Christophe, Tan, Dunlin, Li, Hong, Teo, Edwin Hang Tong, Baillargeat, Dominique, Tay, Beng Kang

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The influence of titanium nitride barrier layer on the properties of CNT bundles by Yap, Chin Chong, Tan, Dunlin, Brun, Christophe, Li, Hong, Teo, Edwin Hang Tong, Dominique, Baillargeat, Tay, Beng Kang

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Carbon nanostructures dedicated to millimeter-wave to THz interconnects by Brun, Christophe, Tan, Chong Wei, Franck, Pierre, Chong, Yap Chin, Lu, Congxiang, Leong, Chow Wai, Tan, Dunlin, Tay, Beng Kang, Coquet, Philippe, Baillargeat, Dominique

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Carbon based multi-functional materials towards 3D system integration : application to thermal and interconnect management by Chow, W. L., Samani, M. K., Yap, Chin Chong, Tan, Dunlin, Shakerzadeh, Maziar, Brun, Christophe, Teo, Edwin Hang Tong, Baillargeat, Dominique, Tay, Beng Kang

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