Effects of Solder Temperature on Pin Through-Hole during Wave Soldering: Thermal-Fluid Structure Interaction Analysis by M. S. Abdul Aziz, M. Z. Abdullah, C. Y. Khor

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Effects of Temperature on the Wave Soldering of Printed Circuit Boards: CFD Modeling Approach by M.S. Abdul Aziz, M. Z. Abdullah, C.Y. Khor, F. Che Ani, N.H. Adam

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Computational Fluid Dynamics Analysis of Varied Cross-Sectional Areas in Sleep Apnea Individuals across Diverse Situations by W. M. Faizal, C. Y. Khor, Suhaimi Shahrin, M. H. M. Hazwan, M. Ahmad, M. N. Misbah, A. H. M. Haidiezul

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Thermal Fluid-Structure Interaction in the Effects of Pin-Through-Hole Diameter during Wave Soldering by M. S. Abdul Aziz, M. Z. Abdullah, C. Y. Khor, Z. M. Fairuz, A. M. Iqbal, M. Mazlan, Mohd Sukhairi Mat Rasat

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