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  1. 1
    End point prediction in wet etching, cleaning, and rinsing of microstructures in semiconductor manufacturing

    End point prediction in wet etching, cleaning, and rinsing of microstructures in semiconductor manufacturing by Calliandra Stuffle, Farhang Shadman

    Published 2022-08-01
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    Article
  2. 2
    Effect of Conditioner Type and Downforce, and Pad Surface Micro-Texture on SiO<sub>2</sub> Chemical Mechanical Planarization Performance

    Effect of Conditioner Type and Downforce, and Pad Surface Micro-Texture on SiO<sub>2</sub> Chemical Mechanical Planarization Performance by Jeffrey McAllister, Calliandra Stuffle, Yasa Sampurno, Dale Hetherington, Jon Sierra Suarez, Leonard Borucki, Ara Philipossian

    Published 2019-04-01
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    Article

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