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    Low Temperature Hydrophilic SiC Wafer Level Direct Bonding for Ultrahigh-Voltage Device Applications

    Low Temperature Hydrophilic SiC Wafer Level Direct Bonding for Ultrahigh-Voltage Device Applications by Wenting Zhang, Caorui Zhang, Junmin Wu, Fei Yang, Yunlai An, Fangjing Hu, Ji Fan

    Published 2021-12-01
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