Radiation effects in MIT Lincoln Lab 3DIC technology by Gouker, Pascale M., Wyatt, Peter W., Yost, Donna-Ruth W., Chen, Chenson K., Chen, Chang-Lee, Knecht, Jeffrey M., Keast, Craig L.

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Channel engineering of SOI MOSFETs for RF applications by Keast, Craig L., Wyatt, Peter W., Healey, Paul D., Yost, Donna-Ruth W., Gouker, Pascale M., Chen, Chenson K., Kedzierski, Jakub T., Knecht, Jeffrey M., Chen, Chang-Lee

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Wafer-scale 3D integration of silicon-on-insulator RF amplifiers by Keast, Craig L., Chen, Chang-Lee, Chen, Chenson K., Yost, Donna-Ruth W., Knecht, Jeffrey M., Wyatt, Peter W., Burns, James A., Warner, Keith, Gouker, Pascale M., Healey, Paul D., Wheeler, Bruce D.

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Microstructural Evolution in Thin Films of Electronic Materials by Thompson, Carl V., Frost, Harold J., Floro, Jerrold A., Liu, Yachin, Cho, Jaeshin, Kahn, Harold, Longworth, Hai P., Smith, Henry I., Palmer, Joyce E., Burns, Geoffrey F., Fonstad, Clifton G., Clevenger, Lawrence A., Ma, En, DeAvillez, Roberto R., Tu, King-Ning, Evans, Paul, Im, James S., Chen, Chenson K., Jiran, Eva, Ro, Jaesang, Dubner, Andrew D., Melngailis, John, Edell, David J.

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Microstructural Evolution in Thin Films of Electronic Materials by Ajuria, Sergio, Quek, Hui Meng, Thompson, Carl V., III, Smith, Henry I., Frost, Harold J., Floro, Jerrold A., Liu, Yauchin, Palmer, Joyce E., Chong, Tow, Fonstad, Clifton G., Jr., Im, James S., Chen, Chenson K., Jiran, Eva, Clevenger, Lawrence A., DeAvillez, Roberto R., Cammarata, Robert C., Judas, Andreas, Olson, John, Tu, King-Ning, Gosele, Ulrich, Cho, Jaeshin, Kahn, Hal, Longworth, Hai P., Ro, Jaesang, Dubner, Andrew D., Melngailis, John

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