Showing 1 - 2 results of 2 for search 'Chia, Hong Ling.', query time: 0.03s Refine Results
  1. 1
    Bonding for 3D ICs and heterogeneous system

    Bonding for 3D ICs and heterogeneous system by Chia, Hong Ling.

    Published 2009
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    Final Year Project (FYP)
  2. 2
    Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits

    Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits by Yan, Li Ling, Gan, Chee Lip, Kor, Katherine Hwee Boon, Chia, Hong Ling, Pey, Kin Leong, Made, Riko I., Thompson, Carl V.

    Published 2013
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    Journal Article

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