Showing 1 - 2 results of 2 for search 'Chih-Pin Hung', query time: 0.04s Refine Results
  1. 1
    Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints

    Relationship between Nanomechanical Responses of Interfacial Intermetallic Compound Layers and Impact Reliability of Solder Joints by Jenn-Ming Song, Bo-Chang Huang, David Tarng, Chih-Pin Hung, Kiyokazu Yasuda

    Published 2020-07-01
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    Article
  2. 2
    Microstructural effects of copper deposits on direct bonding for 3D IC integration

    Microstructural effects of copper deposits on direct bonding for 3D IC integration by Zong-Yu Xie, Po-Kai Huang, Yin-Chi Lu, Golden Kao, Chih-Pin Hung, Kiyokazu Yasuda, Jenn-Ming Song

    Published 2024-01-01
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    Article

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