Fabrication of high aspect-ratio polysilicon microstructures for microsystem techonology applications by Chong, Gang Yih.

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Advanced wafer bonding for substrate engineering and 3D IC integration by Chong, Gang Yih

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AlN-AlN layer bonding and it's thermal characteristics by Shuyu, Bao, Lee, Kwang Hong, Chong, Gang Yih, Fitzgerald, Eugene A., Tan, Chuan Seng

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AlN-AlN wafer bonding and its thermal characteristics by Bao, Shunyu, Lee, Kwang Hong, Chong, Gang Yih, Fitzgerald, Eugene A, Tan, Chuan Seng

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Defects reduction of Ge epitaxial film in a germanium-on-insulator wafer by annealing in oxygen ambient by Lee, Kwang Hong, Bao, Shuyu, Chong, Gang Yih, Tan, Yew Heng, Fitzgerald, Eugene A., Tan, Chuan Seng

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Defects reduction of Ge epitaxial film in a germanium-on-insulator wafer by annealing in oxygen ambient by Lee, Kwang Hong, Bao, Shuyu, Chong, Gang Yih, Tan, Yew Heng, Fitzgerald, Eugene A., Tan, Chuan Seng

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Fabrication and characterization of germanium-on-insulator through epitaxy, bonding, and layer transfer by Lee, Kwang Hong, Bao, Shuyu, Chong, Gang Yih, Tan, Yew Heng, Fitzgerald, Eugene A., Tan, Chuan Seng

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3D geometric engineering of the double wedge-like electrodes for filament-type RRAM device performance improvement by Sun, Jianxun, Li, Yuanbo, Ye, Yiyang, Zhang, Jun, Chong, Gang Yih, Tan, Juan Boon, Liu, Zhen, Chen, Tupei

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