Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers by Wang, Jun Jun, Zhang, Yue Ping, Chua, Kai Meng, Lu, Albert Chee Wai

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Antenna-in-package design for wirebond interconnection to highly integrated 60-GHz radios by Wai, L. L., Sun, Mei, Liu, Duixian, Zhang, Yue Ping, Chua, Kai Meng

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Integration of grid array antenna in chip package for highly integrated 60-GHz radios by Guo, Y. X., Wai, L. L., Sun, Mei, Zhang, Yue Ping, Chua, Kai Meng

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Integration of Yagi antenna in LTCC package for differential 60-GHz radio by Gaucher, B. P., Wai, L. L., Zhang, Yue Ping, Sun, Mei, Liu, Duixian, Chua, Kai Meng

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