Showing 1 - 12 results of 12 for search 'Chunjin Hang', query time: 0.06s Refine Results
  1. 1
    Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock

    Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock by Chunjin Hang, Ruyu Tian, Liyou Zhao, Yanhong Tian

    Published 2018-10-01
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  2. 2
    In-situ fusion process and Cu–Sn compounds evolution mechanism of nano-intermetallic compound mixed solder joints

    In-situ fusion process and Cu–Sn compounds evolution mechanism of nano-intermetallic compound mixed solder joints by He Gao, Wei Liu, Rong An, Chunjin Hang, Yanhong Tian

    Published 2023-09-01
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  3. 3
    Ultrafast Parallel Micro-Gap Resistance Welding of an AuNi<sub>9</sub> Microwire and Au Microlayer

    Ultrafast Parallel Micro-Gap Resistance Welding of an AuNi<sub>9</sub> Microwire and Au Microlayer by He Zhang, Shang Wang, Bingying Wu, Weiwei Zhang, Chunjin Hang, Yanhong Tian

    Published 2021-01-01
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  4. 4
    Effect of gamma irradiation on microstructural evolution and mechanical properties of Sn3Ag0.5Cu solder joints

    Effect of gamma irradiation on microstructural evolution and mechanical properties of Sn3Ag0.5Cu solder joints by Qilong Guan, Chunjin Hang, Gang Yao, Shengli Li, Dan Yu, Ying Ding, Yanhong Tian

    Published 2023-05-01
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  5. 5
    Research Progress on the Solder Joint Reliability of Electronics Using in Deep Space Exploration

    Research Progress on the Solder Joint Reliability of Electronics Using in Deep Space Exploration by Qilong Guan, Chunjin Hang, Shengli Li, Dan Yu, Ying Ding, Xiuli Wang, Yanhong Tian

    Published 2023-02-01
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  6. 6
    Mechanical Properties and Fatigue Life Analysis of Motion Cables in Sensors under Cyclic Loading

    Mechanical Properties and Fatigue Life Analysis of Motion Cables in Sensors under Cyclic Loading by Weizhe Liang, Wei Guan, Ying Ding, Chunjin Hang, Yan Zhou, Xiaojing Zou, Shenghai Yue

    Published 2024-02-01
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  7. 7
    A Modified Interposer Fabrication Process by Copper Nano-Pillars Filled in Anodic Aluminum Oxide Film for 3D Electronic Package

    A Modified Interposer Fabrication Process by Copper Nano-Pillars Filled in Anodic Aluminum Oxide Film for 3D Electronic Package by Chunjin Hang, He Zhang, Yanhong Tian, Chenxi Wang, Yuan Huang, Zhen Zheng, Chunqing Wang

    Published 2018-11-01
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  8. 8
    Die-attach bonding at 230 °C using micron Sn-coated Zn particles for high-temperature applications

    Die-attach bonding at 230 °C using micron Sn-coated Zn particles for high-temperature applications by Fengyi Wang, Xinjie Wang, Xingchao Mao, Fangcheng Duan, Chunjin Hang, Hongtao Chen, Mingyu Li

    Published 2022-11-01
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  9. 9
    Fabrication of Novel Printable Electrically Conductive Adhesives (ECAs) with Excellent Conductivity and Stability Enhanced by the Addition of Polyaniline Nanoparticles

    Fabrication of Novel Printable Electrically Conductive Adhesives (ECAs) with Excellent Conductivity and Stability Enhanced by the Addition of Polyaniline Nanoparticles by Jiayue Wen, Yanhong Tian, Chunjin Hang, Zhen Zheng, He Zhang, Zhipeng Mei, Xuanyi Hu, Yanqing Tian

    Published 2019-07-01
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  10. 10
    Effect of gamma irradiation on microstructural evolution and mechanical properties of SnPb eutectic solder joints

    Effect of gamma irradiation on microstructural evolution and mechanical properties of SnPb eutectic solder joints by Qilong Guan, Chunjin Hang, Shengli Li, Xiaojiu Tang, Gang Yao, Dan Yu, Ying Ding, Xiuli Wang, Wei Zhang

    Published 2023-11-01
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  11. 11
    High-efficiency extraction synthesis for high-purity copper nanowires and their applications in flexible transparent electrodes

    High-efficiency extraction synthesis for high-purity copper nanowires and their applications in flexible transparent electrodes by He Zhang, Shang Wang, Yanhong Tian, Jiayue Wen, Chunjin Hang, Zhen Zheng, Yilong Huang, Su Ding, Chenxi Wang

    Published 2020-06-01
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    Article
  12. 12
    A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging

    A Multilayer Paste Based on Ag Nanoparticles with Cu@Sn for Die Attachment in Power Device Packaging by Jintao Wang, Xinjie Wang, Lin Zhang, Luobin Zhang, Fangcheng Duan, Fengyi Wang, Weiwei Zhang, Jianqiang Wang, Zheng Zhang, Chunjin Hang, Hongtao Chen

    Published 2022-01-01
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