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  1. 1
    Mechanism of Grain Densification in Nano- and Poly-Crystalline Cu Films and Its Impact in Advanced Metallization Processes

    Mechanism of Grain Densification in Nano- and Poly-Crystalline Cu Films and Its Impact in Advanced Metallization Processes by Brunella Cafra, Alessandra Alberti, Gaetano Calogero, Ioannis Deretzis, Antonio Landi, Daniele Pagano, Salvatore Sanzaro, Antonino La Magna

    Published 2024-01-01
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    Article
  2. 2
    Predictive Maintenance of Pins in the ECD Equipment for Cu Deposition in the Semiconductor Industry

    Predictive Maintenance of Pins in the ECD Equipment for Cu Deposition in the Semiconductor Industry by Umberto Amato, Anestis Antoniadis, Italia De Feis, Domenico Fazio, Caterina Genua, Irène Gijbels, Donatella Granata, Antonino La Magna, Daniele Pagano, Gabriele Tochino, Patrizia Vasquez

    Published 2023-07-01
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