Progress and challenges in the direct monolithic integration of III-V devices and Si CMOS on silicon substrates by Fitzgerald, Eugene A., Bulsara, Mayank, Augendre, E., Benaissa, L., Daval, N., Drazek, C., Thompson, R., Clark, D., Smith, D., Choe, M. J., Bergman, J., Ha, W., Urteaga, M., Liu, W. K., Fastenau, J. M., Lubyshev, D., LaRoche, J. R., Kazior, T. E.

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A high performance differential amplifier through the direct monolithic integration of InP HBTs and Si CMOS on silicon substrates by Bulsara, Mayank, Fitzgerald, Eugene A., LaRoche, J. R., Kazior, T. E., Lubyshev, D., Fastenau, J. M., Liu, W. K., Urteaga, M., Ha, W., Bergman, J., Choe, M. J., Smith, D., Clark, D., Thompson, R., Drazek, C., Daval, N., Benaissa, L., Augendre, E.

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Thermal considerations for advanced SOI substrates designed for III-V/Si heterointegration by Bulsara, Mayank, Fitzgerald, Eugene A., Yang, N., Liu, W. K., Lubyshev, D., Fastenau, J. M., Wu, Y., Urteaga, M., Ha, W., Bergman, J., Brar, B., Drazek, C., Daval, N., Benaissa, L., Augendre, E., Hoke, William E., LaRoche, J. R., Herrick, K. J., Kazior, T. E.

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