Through-Silicon via Device Non-Destructive Defect Evaluation Using Ultra-High-Resolution Acoustic Microscopy System by Tae Hyeong Kim, Dongchan Kang, Jeong Nyeon Kim, Ik Keun Park

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Characteristics of TiN Thin Films Deposited by Substrate Temperature Variables Using Scanning Acoustic Microscopy by Dongchan Kang, Young Sung Kim, Jeong Nyeon Kim, Ik Keun Park

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Evaluation of Adhesion Properties of Thin Film Structure through Surface Acoustic Wave Dispersion Simulation by Yu Min Choi, Dongchan Kang, Jeong Nyeon Kim, Ik Keun Park

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Reliability Assessment of PAUT Technique in Lieu of RT for Tube Welds in Thermal Power Plant Facilities by Yu Min Choi, Dongchan Kang, Young Lae Kim, Sungjong Cho, Taesung Park, Ik Keun Park

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Reliability Analysis of PAUT Based on the Round-Robin Test for Pipe Welds with Thermal Fatigue Cracks by Dongchan Kang, Yu Min Choi, Dong Min Lee, Jung Bin Kim, Yong Kwon Kim, Tae Sung Park, Ik Keun Park

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