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  1. 1
    Framework for characterization of copper interconnect in damascene CMP processes

    Framework for characterization of copper interconnect in damascene CMP processes by Park, Tae Hong, 1973-

    Published 2009
    Other Authors: “…Duane Boning and James Chung.…”
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    Thesis
  2. 2
    Characterization and modeling of uniformity in chemical mechanical polishing

    Characterization and modeling of uniformity in chemical mechanical polishing by Oji, Charles (Charles Ojih), 1974-

    Published 2013
    Other Authors: “…Duane Boning and James Chung.…”
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    Thesis

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