Methods to Improve Accuracy of Electronic Component Positioning in Thermoformed Electronics by Behnam Madadnia, Jan Vanfleteren, Frederick Bossuyt

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Testing for Wearability and Reliability of TPU Lamination Method in E-Textiles by Paula Veske, Frederick Bossuyt, Jan Vanfleteren

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Stretchability—The Metric for Stretchable Electrical Interconnects by Bart Plovie, Frederick Bossuyt, Jan Vanfleteren

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Measuring the Flex Life of Conductive Yarns in Narrow Fabric by Paula Veske, Frederick Bossuyt, Filip Thielemans, Jan Vanfleteren

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A Study on Over-Molded Copper-Based Flexible Electronic Circuits by Mona Bakr, Martin Hubmann, Frederick Bossuyt, Jan Vanfleteren

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Measuring the Flex Life of Conductive Yarns in Narrow Fabric by Paula Veske, Frederick Bossuyt, Filip Thielemans, Jan Vanfleteren

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Development and Washing Reliability Testing of a Stretchable Circuit on Knit Fabric by Paula Veske, Pieter Bauwens, Frederick Bossuyt, Tom Sterken, Jan Vanfleteren

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Parameter Study on Force Curves of Assembled Electronic Components on Foils during Injection Overmolding Using Simulation by Martin Hubmann, Mona Bakr, Jonas Groten, Martin Pletz, Jan Vanfleteren, Frederick Bossuyt, Behnam Madadnia, Barbara Stadlober

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Process Optimization of Injection Overmolding Structural Electronics with Regard to Film Distortion by Martin Hubmann, Behnam Madadnia, Jonas Groten, Martin Pletz, Jan Vanfleteren, Barbara Stadlober, Frederick Bossuyt, Jatinder Kaur, Thomas Lucyshyn

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