Microstructure Evolution and Shear Strength of Tin-Indium-xCu/Cu Joints by Duy Le Han, Yu-An Shen, Fupeng Huo, Hiroshi Nishikawa

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Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging by Fupeng Huo, Chuantong Chen, Zheng Zhang, Ye Wang, Aiji Suetake, Kazutaka Takeshita, Yoshiji Yamaguchi, Yashima Momose, Katsuaki Suganuma

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Behavior of Sn-3.0Ag-0.5Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere by Siliang He, Yu-An Shen, Bifu Xiong, Fupeng Huo, Jiahui Li, Jinguo Ge, Zhiliang Pan, Wangyun Li, Chuan Hu, Hiroshi Nishikawa

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