Transient liquid phase Ag-based solder technology for high-temperature packaging applications by Sharif, Ahmed, Gan, Chee Lip, Chen, Zhong

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A comprehensive data retrieval and correction approach from 40-nm flash memory with selective chemical engraving by Zeng, Xiaomei, Liu, Qing, Gan, Chee Lip

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Impact of pre-existing voids on electromigration in copper interconnects by Mario, Hendro, Lim, Meng Keong, Gan, Chee Lip

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Sample preparation for deprocessing of 3D multi-die stacked package by Kor, Katherine Hwee Boon, Liu, Q., Gan, Chee Lip

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Microstructure and mechanical properties of electroplated Ni-Sn TLP bonded joints with different bonding and aging times by Yan, Guangxu, Gill, Vincent, Gan, Chee Lip, Chen, Zhong

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Modeling of electromigration induced contact resistance reduction of Cu-Cu bonded interface by Made, Riko I., Gan, Chee Lip, Tan, Chuan Seng

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Enhanced shape memory and superelasticity in small-volume ceramics: a perspective on the controlling factors by Zeng, Xiaomei, Du, Zehui, Schuh, Christopher A, Gan, Chee Lip

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Shape Memory and Superelastic Ceramics at Small Scales by Lai, Alan, Du, Zehui, Gan, Chee Lip, Schuh, Christopher A.

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Unraveling the mechanistic origins of epoxy degradation in acids by Lim, Jacob Song Kiat, Gan, Chee Lip, Hu, Matthew Xiao

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Thermal reliability of a bilayer of Ni(P)/Cu as a diffusion barrier for Cu/Sn/Cu bonding by Lee, Byunghoon, Jeon, Haseok, Gan, Chee Lip, Lee, Hoo-Jeong

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Selective staining on non-volatile memory cells for data retrieval by Zeng, Xiaomei, Liu, Qing, Tay, Jing Yun, Gan, Chee Lip

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Enhanced shape memory and superelasticity in small-volume ceramics: a perspective on the controlling factors by Zeng, Xiaomei, Du, Zehui, Schuh, Christopher A., Gan, Chee Lip

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Au-In-based hermetic sealing for MEMS packaging for down-hole application by Vivek, Chidambaram, Chen, Bangtao, Gan, Chee Lip, Daniel, Rhee Min Woo

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Impact of carbon impurities on the initial leakage current of AlGaN/GaN high electron mobility transistors by Gao, Yu, Gan, Chee Lip, Thompson, C. V., Sasangka, W. A.

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Shape-memory actuation in aligned zirconia nanofibers for artificial muscle applications at elevated temperatures by Du, Zehui, Zhou, Xinran, Ye, Pengcheng, Zeng, Xiaomei, Gan, Chee Lip

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The study of Ni-Sn transient liquid phase bonded joints under high temperatures by Yan, Guangxu, Bhowmik, Ayan, Gill, Vincent, Gan, Chee Lip, Chen, Zhong

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Crystal orientation dependence of the stress-induced martensitic transformation in zirconia-based shape memory ceramics by Zeng, Xiao Mei, Lai, Alan, Gan, Chee Lip, Schuh, Christopher A.

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A facile route to synthesise silica shell free silicide nanowires by Li, Shaozhou, Cai, Hui, Gan, Chee Lip, Guo, Jun, Ma, Ja

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Laser focus depth adaptation for decapsulation of copper wirebonded devices by Kor, Katherine Hwee Boon, Liu, Qing, Siah, Yu Wen, Gan, Chee Lip

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Decapsulation of 3D multi-die stacked package by Kor, Katherine Hwee Boon, Liu, Q., Siah, Yu Wen, Gan, Chee Lip

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