Students’ learning styles and their effects on the use of social media technology for learning by Balakrishnan, Vimala, Gan, C.L.

Students' learning styles and their effects on the use of social media technology for learning by Balakrishnan, Vimala, Gan, C.L.

Agent based adaptive packet routing in reconfigurable wireless array sensor network, using reinforcement learning for static charges monitoring at petronas petroleum installation t... by Ismail, Ishak, Gan, Z. L.

Network topology of economic sectors by Djauhari, M. A., Gan, S. L.

Role of emotional intelligence and mental health in improving performance by Gan, J. L., Yusof, H. M.

An Improved Multivariate Short Run Control Chart Based On The CUSUM Statistic by Khoo, Michael B. C., Gan, H. L.

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Impact of field enhancement on TDDB lifetimes of Cu/Low-k test structures by Gan, C. L., Tan, T. L., Ong, R. X.

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Internally Heated Screw Pyrolysis Reactor (IHSPR) heat transfer performance study by Teo, S. H., Gan, H. L., Azri, Alias, Gan, Leong Ming

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Temperature control with a thermoelectric cooler (TEC) during laser decapsulation of plastic packages by Kor, H. B., Chang, A. C. K., Gan, C. L.

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Impact of carbon impurities on the initial leakage current of AlGaN/GaN high electron mobility transistors by Sasangka, W.A., Gao, Y., Gan, C.L., Thompson, Carl Vernette

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Reliability of Multi-Terminal Copper Dual-Damascene Interconnect Trees by Gan, C.L., Thompson, Carl V., Pey, Kin Leong, Choi, Wee Kiong

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3D current path in stacked devices : metrics and challenges by Kor, H. B., Infante, F., Perdu, P., Gan, C. L., Lewis, D.

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Modelling cyber-crime protection behaviour among computer users in the context of Bangladesh by Mahmud, I., Ramayah, T., Nayeem, M. M. H., Islam, S. M. M., Gan, P. L.

Effects of Applied Loads, Effective Contact Area and Surface Roughness on the Dicing Yield of 3D Cu Bonded Interconnects by Leong, Hoi Liong, Gan, C.L., Pey, Kin Leong, Thompson, Carl V., Li, Hongyu

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Observation of Joule Heating-Assisted Electromigration Failure Mechanisms for Dual Damascene Cu/SiO₂ Interconnects by Chang, Choon Wai, Gan, C.L., Thompson, Carl V., Pey, Kin Leong, Choi, Wee Kiong

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Uniform delayering of copper metallization by Siah, Yu Wen, Hong, Y. J., Liu, Q., Kor, Katherine Hwee Boon, Gan, C. L.

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Mortality Dependence of Cu Dual Damascene Interconnects on Adjacent Segments by Chang, Choon Wai, Gan, C.L., Thompson, Carl V., Pey, Kin Leong, Choi, Wee Kiong, Hwang, N.

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Preliminary Characterisation of Low-Temperature Bonded Copper Interconnects for 3-D Integrated Circuits by Leong, Hoi Liong, Gan, C.L., Pey, Kin Leong, Tsang, Chi-fo, Thompson, Carl V., Hongyu, Li

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Physicochemical and sensory analysis of instant cereal beverage incorporated with corncob powder by Lee, C. M., Chan, Y. L., Gan, Y. L., Tang, T. K., Tan, Chin Ping, Lai, Oi Ming

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Physicochemical and sensory analysis of instant cereal beverage incorporated with corncob powder by Lee, C.M., Chan, Y.L., Gan, Y.L., Tang, T.K., Tan, C.P., Lai, O.M.

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