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Silicon Oxide Etching Process of NF<sub>3</sub> and F<sub>3</sub>NO Plasmas with a Residual Gas Analyzer by Woo-Jae Kim, In-Young Bang, Ji-Hwan Kim, Yeon-Soo Park, Hee-Tae Kwon, Gi-Won Shin, Min-Ho Kang, Youngjun Cho, Byung-Hyang Kwon, Jung-Hun Kwak, Gi-Chung Kwon
Published 2021-06-01
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Necking Reduction at Low Temperature in Aspect Ratio Etching of SiO<sub>2</sub> at CF<sub>4</sub>/H<sub>2</sub>/Ar Plasma by Hee-Tae Kwon, In-Young Bang, Jae-Hyeon Kim, Hyeon-Jo Kim, Seong-Yong Lim, Seo-Yeon Kim, Seong-Hee Cho, Ji-Hwan Kim, Woo-Jae Kim, Gi-Won Shin, Gi-Chung Kwon
Published 2024-01-01
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