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    Monolithic integration of Si-CMOS and III-V-on-Si through direct wafer bonding process

    Monolithic integration of Si-CMOS and III-V-on-Si through direct wafer bonding process by Lee, Kwang Hong, Wang, Yue, Wang, Bing, Zhang, Li, Sasangka, Wardhana Aji, Goh, Shuh Chin, Bao, Shuyu, Lee, Kenneth E., Fitzgerald, Eugene A., Tan, Chuan Seng

    Published 2018
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    Journal Article

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