Showing 1 - 15 results of 15 for search 'Guo Ningqun', query time: 0.02s
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1
Long range nondestructive testing of honeycomb structures by Guo, Ningqun, Lim, Mong King
Published 2008
Research Report -
2
Dynamic characteristics of ultrasonic wire bonders by Guo, Ningqun., Ling, Shih Fu.
Published 2008
Research Report -
3
Characterisation of defects in composite materials using ultrasonic testing by Hing, Peter., Tan, Kha Sheng., Tui, Chen Guan., Guo, Ningqun., Wong, Brian Stephen.
Published 2008
Research Report -
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Development of a data acquisition system for plate waves testing by Han, Dingzhi
Published 2009Other Authors: “…Guo Ningqun…”
Final Year Project (FYP) -
6
Characterization of PVDF hollow fiber membrane by Lau, Xiang Ling.
Published 2009Other Authors: “…Guo Ningqun…”
Final Year Project (FYP) -
7
Simulation of lamb wave in composite for structural health monitoring by Ge, Yao.
Published 2009Other Authors: “…Guo Ningqun…”
Final Year Project (FYP) -
8
Characterisation of PES hollow fibre membranes by Fang, Rongquan
Published 2009Other Authors: “…Guo Ningqun…”
Final Year Project (FYP) -
9
Design and optimization of ultrasonic array transducers for medical imaging applications by Wang, Qiong Bo
Published 2008Other Authors: “…Guo, Ningqun…”
Thesis -
10
Ultrasonic characterisation of interfaces in IC packaging by Wang, Yi
Published 2008Other Authors: “…Guo Ningqun…”
Thesis -
11
Development of vibration modeling, testing and control techniques for hard disk drives by Xu, Limei.
Published 2008Other Authors: “…Guo, Ningqun…”
Thesis -
12
Ultrasonic evaluation of weak mold compound/silicon interfaces in IC packages by Yeo, Hwee Chung.
Published 2008Other Authors: “…Guo, Ningqun…”
Thesis -
13
Applications of automated defects recognition in IC packaging based on ultrasound C-SAM images by Zhang, Yilu.
Published 2008Other Authors: “…Guo, Ningqun…”
Thesis -
14
Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages by Abdul Jaleel B. Shahul Hamid
Published 2008Other Authors: “…Guo, Ningqun…”
Thesis -
15
Dynamic characteristics of the wire bonding process in electronic packaging by Hu, Changmin.
Published 2008Other Authors: “…Guo, Ningqun…”
Thesis