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HUA JianWei
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FINITE ELEMENT STRESS AND STRAIN ANALYSIS OF BGA SOLDER JOINT OF BOARD LEVEL OPTICAL INTERCONNECTION MODULE UNDER TEMPERATURE AND VIBRATION COUPLED CONDITION
by
HUA JianWei
,
HUANG ChunYue
,
LIANG Ying
,
HUANG Wei
,
ZHANG Long
Published 2018-01-01
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