Progress and challenges in the direct monolithic integration of III-V devices and Si CMOS on silicon substrates Yazar: Fitzgerald, Eugene A., Bulsara, Mayank, Augendre, E., Benaissa, L., Daval, N., Drazek, C., Thompson, R., Clark, D., Smith, D., Choe, M. J., Bergman, J., Ha, W., Urteaga, M., Liu, W. K., Fastenau, J. M., Lubyshev, D., LaRoche, J. R., Kazior, T. E.

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Tam Metin Erişim

A high performance differential amplifier through the direct monolithic integration of InP HBTs and Si CMOS on silicon substrates Yazar: Bulsara, Mayank, Fitzgerald, Eugene A., LaRoche, J. R., Kazior, T. E., Lubyshev, D., Fastenau, J. M., Liu, W. K., Urteaga, M., Ha, W., Bergman, J., Choe, M. J., Smith, D., Clark, D., Thompson, R., Drazek, C., Daval, N., Benaissa, L., Augendre, E.

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Tam Metin Erişim

Thermal considerations for advanced SOI substrates designed for III-V/Si heterointegration Yazar: Bulsara, Mayank, Fitzgerald, Eugene A., Yang, N., Liu, W. K., Lubyshev, D., Fastenau, J. M., Wu, Y., Urteaga, M., Ha, W., Bergman, J., Brar, B., Drazek, C., Daval, N., Benaissa, L., Augendre, E., Hoke, William E., LaRoche, J. R., Herrick, K. J., Kazior, T. E.

Tam Metin Erişim
Tam Metin Erişim