Applications of multi-walled carbon nanotube in electronic packaging by Tan, Cher Ming, Baudot, Jacques Desire Charles, Han, Yongdian, Jing, Hongyang

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Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling by Nai, S. M. L., Xu, L. Y., Wei, J., Han, Yongdian, Jing, Hongyang, Tan, Cher Ming

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Effect of Ni-coated carbon nanotubes on interfacial intermetallic layer growth by Nai, S. M. L., Xu, L. Y., Han, Yongdian, Jing, Hongyang, Tan, Cher Ming, Wei, Jun

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Effect of Ni-coated carbon nanotubes on interfacial reaction and shear strength of Sn-Ag-Cu solder joints by Nai, S. M. L., Xu, L. Y., Wei, J., Jing, Hongyang, Tan, Cher Ming, Han, Yongdian

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Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes by Nai, S. M. L., Xu, L. Y., Wei, J., Han, Yongdian, Jing, Hongyang, Tan, Cher Ming

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A new creep model for SnAgCu lead-free composite solders : incorporating back stress by Nai, S. M. L., Xu, L. Y., Zhang, S. R., Han, Yongdian, Jing, Hongyang, Tan, Cher Ming, Wei, Jun

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