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Design method of thermal connector for electronic equipment cooling by Tomoo HAYASHI, Yoshihiro KONDO, Hiroyuki TOYODA, Shigemasa SATO, Shigeyasu TSUBAKI
Published 2017-05-01
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Study on dry-out occurrence in inclined loop thermosyphon for CPU cooling by Hiroyuki TOYODA, Yoshihiro KONDO, Shigemasa SATO, Shigeyasu TSUBAKI, Shigeki HIRASAWA
Published 2014-12-01
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