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    Via Diode in Cu Backend Process for 3D Cross-Point RRAM Arrays

    Via Diode in Cu Backend Process for 3D Cross-Point RRAM Arrays by Yu-Cheng Liao, Hsin-Wei Pan, Min-Che Hsieh, Tzong-Sheng Chang, Yu-Der Chih, Ming-Jinn Tsai, Chrong Jung Lin, Ya-Chin King

    Published 2014-01-01
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