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Evidence of ultra-low-k dielectric material degradation and nanostructure alteration of the Cu/ultra-low-k interconnects in time-dependent dielectric breakdown failure by Lam, Jeffrey C. K., Huang, Maggie Y. M., Ng, Tsu Hau, Mohammed Khalid Dawood, Zhang, Fan, Du, Anyan, Sun, Handong, Shen, Zexiang, Mai, Zhihong
Published 2013
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Journal Article