Crosstalk study on transmission lines of embedded substrate by Huang Wei, Huang Chunyue, Zhai Jianghui

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RESEARCH ON HEAT DISSIPATION OF LTCC SUBSTRATE MICROCHANNEL BASED ON ORTHOGONAL DESIGN by HE Wei, HUANG ChunYue, LIANG Ying

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FINITE ELEMENT STRESS AND STRAIN ANALYSIS OF BGA SOLDER JOINT OF BOARD LEVEL OPTICAL INTERCONNECTION MODULE UNDER TEMPERATURE AND VIBRATION COUPLED CONDITION by HUA JianWei, HUANG ChunYue, LIANG Ying, HUANG Wei, ZHANG Long

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STUDY ON ELECTRONIC PACKAGE MINIATURE BALL GRID ARRAY SOLDER JOINTS STRESS AND STRAIN UNDER THREE POINT BENDING by LIANG Ying, HUANG ChunYue, YIN Rui, HUANG Wei, LI TianMing, ZHAO HongWang

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