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    Adhesion property between low-thermal-expansion poly(benzoxazole-imide) film and ion-implanted copper

    Adhesion property between low-thermal-expansion poly(benzoxazole-imide) film and ion-implanted copper by CUI Chao, YUAN Lili, YIN Liang, HUANG Yudong, MENG Linghui, YANG Nianqun, YANG Shiyong

    Published 2022-10-01
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