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Ultrasonic-assisted soldering of Mg alloy joints using Cu-foam/Sn composite solder foils by Shiqin Li, Yinggan Zhang, Huijun Cao, Xuzhang Zheng, Shuye Zhang, Zhihao Zhang
Published 2022-06-01
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Effect of the anisotropic characteristics of β-Sn on current-induced solder evolution by Huijun Cao, Yu Zhang, Yinggan Zhang, Jiajia Han, Dongchuan Su, Zhihao Zhang
Published 2022-12-01
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