Author Search Results :: UTM Library Massive Scholar Tracking

1

Study of Copper-Nickel Nanoparticle Resistive Ink Compatible with Printed Copper Films for Power Electronics Applications by Jiri Hlina, Jan Reboun, Ales Hamacek

Published 2021-11-01

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2

Study of Internal Stress in Conductive and Dielectric Thick Films by Jiri Hlina, Jan Reboun, Martin Janda, Ales Hamacek

Published 2022-12-01

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3

Solder joints on thick printed copper substrates by Martin Hirman, David Michal, Jan Reboun, Frantisek Steiner

Published 2024-04-01

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4

Study of New Nitrogen-Fireable Copper-Nickel Thick Film Paste Formulation Compatible with Thick Printed Copper by Jiri Hlina, Jan Reboun, Marek Simonovsky, Tomas Syrovy, Martin Janda, Ales Hamacek

Published 2022-02-01

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5

Novel SMD Component and Module Interconnection and Encapsulation Technique for Textile Substrates Using 3D Printed Polymer Materials by David Kalaš, Radek Soukup, Jan Řeboun, Michaela Radouchová, Pavel Rous, Aleš Hamáček

Published 2023-05-01

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6

FFF 3D Printing in Electronic Applications: Dielectric and Thermal Properties of Selected Polymers by David Kalaš, Karel Šíma, Petr Kadlec, Radek Polanský, Radek Soukup, Jan Řeboun, Aleš Hamáček

Published 2021-10-01

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