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    Electrodeposition Patterned Copper Foam with Micro/Nanostructures for Reducing Supercooling in Water-Based Cool Storage Phase-Change Materials

    Electrodeposition Patterned Copper Foam with Micro/Nanostructures for Reducing Supercooling in Water-Based Cool Storage Phase-Change Materials by Mou Xu, Yu-Feng Chen, Jian-Yang Liang, Dong-Chuan Mo, Shu-Shen Lyu

    Published 2020-06-01
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