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    Thermal stability and bonding interface in Cu/SiO2 hybrid bonding on nano-twinned copper

    Thermal stability and bonding interface in Cu/SiO2 hybrid bonding on nano-twinned copper by Jou-Chun Ou, Yi-Yun Tsai, Ting-Chun Lin, Chin-Li Kao, Shih-Chieh Hsiao, Fei-Ya Huang, Jui-Chao Kuo

    Published 2022-06-01
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