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    Hardness and assessment of adhesion of monolayer and multilayer nickel thin films electrochemically deposited on silicon substrates with and without the ultrasonic agitation

    Hardness and assessment of adhesion of monolayer and multilayer nickel thin films electrochemically deposited on silicon substrates with and without the ultrasonic agitation by Lamovec Jelena, Jović Vesna, Jaćimovski Stevo, Jovanov Goran, Radojević Vesna, Šetrajčić Jovan

    Published 2019-01-01
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