Effect of LST parameter on surface morphology of modified copper substrates by Siti Faqihah, Roduan, Juyana, A. Wahab, Mohd Arif Anuar, Mohd Salleh, Nurul Aida Husna, Mohd Mahayuddin, Aiman, Mohd Halil, M., Ishak

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Characterization of SnO 2/TiO 2 with the Addition of Polyethylene Glycol via Sol-Gel Method for Self-Cleaning Application by Dewi Suriyani Che Halin, A. Azliza, Kamrosni Abdul Razak, Mohd Mustafa Albakri Abdullah, Mohd Arif Anuar Mohd Salleh, Juyana A Wahab, V. Chobpattana, L. Kaczmarek, M. Nabiałek, B. Jeż

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Effectiveness of dimple microtextured copper substrate on performance of Sn-0.7Cu solder alloy by Siti Faqihah, Roduan, Juyana, A. Wahab, Mohd Arif Anuar, Mohd Salleh, Nurul Aida Husna, Mohd Mahayuddin, Mohd Mustafa, Al Bakri Abdullah, Aiman, Mohd Halil, Amira Qistina Syamimi, Zaifuddin, Mahadzir, Ishak, Sandu, Andrei Victor, Baltatu, Mădălina Simona, Vizureanu, Petrica

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Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy by Siti Faqihah Roduan, Juyana A. Wahab, Mohd Arif Anuar Mohd Salleh, Nurul Aida Husna Mohd Mahayuddin, Mohd Mustafa Al Bakri Abdullah, Aiman Bin Mohd Halil, Amira Qistina Syamimi Zaifuddin, Mahadzir Ishak Muhammad, Andrei Victor Sandu, Mădălina Simona Baltatu, Petrica Vizureanu

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