THERMAL PERFORMANCE PREDICTION OF PLASTICS BALL GRID ARRAY (PBGA) USING ARTIFICIAL NEURAL NETWORK gan C.H. Leong, I.A. Azid, K.N. Seetharamu

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Thermal Perfomarmance Prediction of Plastics Ball Grid Array (PBGA) using Artificial Neural Network gan C H Leong, I A Aziz, K N Seetharamu

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Creep analysis of bimaterial microcantilever beam for sensing device using artificial neural network (ANN) gan WaiChi Wong, HingWah Lee, Ishak A. Azid, K.N. Seetharamu

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APPLICATION OF BACK PROPAGATION NEURAL NETWORK IN PREDICTING PALM OIL MILL EMISSION gan I.A. Azid, A.R. Yusoff, K.N. Seetharamu, A.L. Ahmad

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STEADY STATE FINITE ELEMENT ANALYSIS OF A SINGLE STACK COLD PLATE WITH HEAT LOSSES gan G. A. Quadir, Shiao Lin Bell, K. N. Seetharamu, A. Y. Hassan

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Steady State Finite element Analysis of a Single Sttack Cold Plate with Heat Losses gan G. A Quadir, Shiao Lin Beh, K N Seetharamu, A Y Hassan

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Effects of pressure on thermal contact resistance for rough mating surfaces gan M. Z. Abdullah, Y. C. Yau, Z. A. Zainal Alauddin, and, K. N. Seetharamu

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Proceedings of International Conference Electronic materials and packaging (EMAP 2004), 5th-7th December 2004, Universiti Sains Malaysia, Penang, Malaysia gan International Conference Electronics Materials and Packaging (EMAP 2004) (6th : 2004 : Universiti Sains Malaysia, Penang), Zaidi Mohd. Ripin, K. N. Seetharamu, Mohd. Zulkifly Abdullah, Universiti Sains Malaysia. School of Mechanical Engineering