Showing 1 - 11 results of 11 for search 'Kai-Cheng Shie', query time: 0.04s Refine Results
  1. 1
    A kinetic model of copper-to-copper direct bonding under thermal compression

    A kinetic model of copper-to-copper direct bonding under thermal compression by Kai-Cheng Shie, A.M. Gusak, K.N. Tu, Chih Chen

    Published 2021-11-01
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  2. 2
    Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps

    Effect of Bonding Strength on Electromigration Failure in Cu–Cu Bumps by Kai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li, K. N. Tu, Chih Chen

    Published 2021-10-01
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  3. 3
    Shearing Characteristics of Cu-Cu Joints Fabricated by Two-Step Process Using Highly <111>-Oriented Nanotwinned Cu

    Shearing Characteristics of Cu-Cu Joints Fabricated by Two-Step Process Using Highly <111>-Oriented Nanotwinned Cu by Jia-Juen Ong, Dinh-Phuc Tran, Shih-Chi Yang, Kai-Cheng Shie, Chih Chen

    Published 2021-11-01
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  4. 4
    Failures of Cu-Cu Joints under Temperature Cycling Tests

    Failures of Cu-Cu Joints under Temperature Cycling Tests by Po-Ning Hsu, Kai-Cheng Shie, Dinh-Phuc Tran, Nien-Ti Tsou, Chih Chen

    Published 2022-07-01
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  5. 5
    Failure Mechanisms of Cu–Cu Bumps under Thermal Cycling

    Failure Mechanisms of Cu–Cu Bumps under Thermal Cycling by Kai-Cheng Shie, Po-Ning Hsu, Yu-Jin Li, Dinh-Phuc Tran, Chih Chen

    Published 2021-09-01
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  6. 6
    Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints

    Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints by Po-Ning Hsu, Dai-Lung Lee, Dinh-Phuc Tran, Kai-Cheng Shie, Nien-Ti Tsou, Chih Chen

    Published 2022-10-01
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  7. 7
    Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing

    Stress Relaxation and Grain Growth Behaviors of (111)-Preferred Nanotwinned Copper during Annealing by Jyun-Yu Lai, Dinh-Phuc Tran, Shih-Chi Yang, I-Hsin Tseng, Kai-Cheng Shie, Jihperng Leu, Chih Chen

    Published 2023-02-01
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  8. 8
    Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu–Cu joints

    Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu–Cu joints by Jia-Juen Ong, Dinh-Phuc Tran, Man-Chi Lan, Kai-Cheng Shie, Po-Ning Hsu, Nien‑Ti Tsou, Chih Chen

    Published 2022-07-01
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  9. 9
    High-Bonding-Strength Polyimide Films Achieved via Thermal Management and Surface Activation

    High-Bonding-Strength Polyimide Films Achieved via Thermal Management and Surface Activation by Pin-Syuan He, Dinh-Phuc Tran, Ting-Yu Kuo, Wei-You Hsu, Huai-En Lin, Kai-Cheng Shie, Chih Chen

    Published 2023-05-01
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  10. 10
    Low-Temperature Cu/SiO<sub>2</sub> Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces

    Low-Temperature Cu/SiO<sub>2</sub> Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces by Jia-Juen Ong, Wei-Lan Chiu, Ou-Hsiang Lee, Chia-Wen Chiang, Hsiang-Hung Chang, Chin-Hung Wang, Kai-Cheng Shie, Shih-Chi Yang, Dinh-Phuc Tran, King-Ning Tu, Chih Chen

    Published 2022-03-01
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  11. 11
    Artificial intelligence deep learning for 3D IC reliability prediction

    Artificial intelligence deep learning for 3D IC reliability prediction by Po-Ning Hsu, Kai-Cheng Shie, Kuan-Peng Chen, Jing-Chen Tu, Cheng-Che Wu, Nien-Ti Tsou, Yu-Chieh Lo, Nan-Yow Chen, Yong-Fen Hsieh, Mia Wu, Chih Chen, King-Ning Tu

    Published 2022-04-01
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