Lead-free soldering in electronics : science, technology and environmental impact / by Katsuaki Suganuma

Microstructure and mechanical properties of sintered Ag particles with flake and spherical shape from nano to micro size by Chuantong Chen, Katsuaki Suganuma

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Large-scale bare Cu bonding by 10 μm-sized Cu–Ag composite paste in low temperature low pressure air conditions by Chuantong Chen, Shuaijie Zhao, Takuya Sekiguchi, Katsuaki Suganuma

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Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules by Chanyang Choe, Chuantong Chen, Seungjun Noh, Katsuaki Suganuma

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Tin Whisker Growth Inhibition in RE-Doped Sn-Zn Soldered Joints by Peng Xue, Weiliang Liang, Peng He, Katsuaki Suganuma, Hao Zhang

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Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining by Dongjin Kim, Yasuyuki Yamamoto, Shijo Nagao, Naoki Wakasugi, Chuantong Chen, Katsuaki Suganuma

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Interfacial microstructures and corrosion behavior of tungsten heavy alloy/superalloy dissimilar joints: design, regulation and mechanism by Yuxin Xu, Xiaoming Qiu, Suyu Wang, Chuantong Chen, Fei Xing, Katsuaki Suganuma

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Development of high thermal conductivity of Ag/diamond composite sintering paste and its thermal shock reliability evaluation in SiC power modules by Yuxin Xu, Xiaoming Qiu, Wangyun Li, Suyu Wang, Ninshu Ma, Minoru Ueshima, Chuantong Chen, Katsuaki Suganuma

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Development of micron-sized Cu–Ag composite paste for oxidation-free bare Cu bonding in air condition and its deterioration mechanism during aging and power cycling tests by Chuantong Chen, Dongjin Kim, Yang Liu, Takuya Sekiguchi, Yutai Su, Xu Long, Canyu Liu, Changqing Liu, Katsuaki Suganuma

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Interface regulation of micro-sized sintered Ag-10Al composite based on in-situ surface modification and enhanced microstructure stability in power electronic packaging by Fupeng Huo, Chuantong Chen, Zheng Zhang, Ye Wang, Aiji Suetake, Kazutaka Takeshita, Yoshiji Yamaguchi, Yashima Momose, Katsuaki Suganuma

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Development of crack-less and deformation-resistant electroplated Ni/electroless Ni/Pt/Ag metallization layers for Ag-sintered joint during a harsh thermal shock by Yang Liu, Chuantong Chen, Zheng Zhang, Minoru Ueshima, Takeshi Sakamoto, Takuya Naoe, Hiroshi Nishikawa, Yukinori Oda, Katsuaki Suganuma

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The Surface Coating of Commercial LiFePO4 by Utilizing ZIF-8 for High Electrochemical Performance Lithium Ion Battery by XiaoLong Xu, CongYu Qi, ZhenDong Hao, Hao Wang, JinTing Jiu, JingBing Liu, Hui Yan, Katsuaki Suganuma

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